Sökning: "Conductive Adhesive"

Visar resultat 1 - 5 av 26 avhandlingar innehållade orden Conductive Adhesive.

  1. 1. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Författare :Markus Dernevik; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Sammanfattning : .... LÄS MER

  3. 2. Modelling of High Power SOI Vertical DMOS Transistors and Flip-chip Packages

    Författare :Kuntjoro Pinardi; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Conductive Adhesive; self-heating; Unclamped Inductive Switching; ACA; vertical DMOS; integration; Flip-chip; UIS; SOI;

    Sammanfattning : Part I: Vertical DMOS Transistors System level integration is a major trend in the electronic industry at the moment. For automotive applications in particular it is desirable to integrate CMOS logic circuits and different types of power devices. LÄS MER

  4. 3. Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications

    Författare :Liqiang Cao; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesion strength; curing degree and curing temperature; moisture effect; flip chip; anisotropic conductive adhesives; reliability;

    Sammanfattning : There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low bonding temperature and fine-pitch capability are the major advantages of conducting adhesive technology. LÄS MER

  5. 4. Surface characteristics, microstructure and manufacturing aspects of conductive adhesive joining in microelectronics packaging

    Författare :Katrin Persson; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER

  7. 5. Thermal Characterization and Modelling in Microsystem Packaging Applications

    Författare :Elisabeth Nyström; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanotubes; Thermal management; Transient Hot Wire; Composite; Microchannels; Anisotropic Conductive Adhesive;

    Sammanfattning : As the electronics circuits grow denser and the power consumption per area unit is increasing, new more efficient technologies for heat removal is necessary. Heat fluxes from the integrated circuit, IC, in the order of 100W/cm2 are not rare. LÄS MER