Sökning: "Anisotropic Conductive Adhesive"

Visar resultat 1 - 5 av 8 avhandlingar innehållade orden Anisotropic Conductive Adhesive.

  1. 1. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Författare :Markus Dernevik; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Sammanfattning : .... LÄS MER

  3. 2. Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications

    Författare :Liqiang Cao; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesion strength; curing degree and curing temperature; moisture effect; flip chip; anisotropic conductive adhesives; reliability;

    Sammanfattning : There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low bonding temperature and fine-pitch capability are the major advantages of conducting adhesive technology. LÄS MER

  4. 3. Thermal Characterization and Modelling in Microsystem Packaging Applications

    Författare :Elisabeth Nyström; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanotubes; Thermal management; Transient Hot Wire; Composite; Microchannels; Anisotropic Conductive Adhesive;

    Sammanfattning : As the electronics circuits grow denser and the power consumption per area unit is increasing, new more efficient technologies for heat removal is necessary. Heat fluxes from the integrated circuit, IC, in the order of 100W/cm2 are not rare. LÄS MER

  5. 4. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

    Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER

  7. 5. Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER