Sökning: "sequential build-up board"

Hittade 5 avhandlingar innehållade orden sequential build-up board.

  1. 1. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Författare :Markus Dernevik; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Sammanfattning : .... LÄS MER

  3. 2. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

    Författare :Steffen Uhlig; Linköpings universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

    Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER

  4. 3. An SBU fully additive production approach for Board-level Electronics Packaging (SBU-CBM Method)

    Författare :Sarthak Acharya; Jerker Delsing; Shailesh Singh Chouhan; Luleå tekniska universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Cyberfysiska system; Cyber-Physical Systems;

    Sammanfattning : The worldwide electronics market is focusing on developing innovative technologies that can lead to denser, more resilient, and tighter board-level integration. The consumer electronics market is trending toward miniaturization, with HDI-PCBs dominating. Electronics shrinking and scaling technology is the prime concern of all manufacturers. LÄS MER

  5. 4. Contactless Test of Circuit Boards

    Författare :Abdelghani Renbi; Heli Jantunen; Luleå tekniska universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Industriell elektronik; Industrial Electronics;

    Sammanfattning : Electronics are still continuing to respond to the small-feature size requirement for economical, performance and environmental benefits.Due to the non-idealities in the manufacturing process of circuit boards, electronics production yield is never 100 %. LÄS MER

  7. 5. Improved PWB test methodologies

    Författare :Abdelghani Renbi; Erik Larsson; Luleå tekniska universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Industriell elektronik; Industrial Electronics;

    Sammanfattning : Printed Wiring Board (PWB) and Printed Circuit Board Assembly (PCBA) testing aims to ensure an error free board after the etching and the assembly processes. After the etching process, several types of errors might occur such as opens and bridges, which are already, showstoppers in Direct Current (DC) applications. LÄS MER