Sökning: "wafer bonding"

Visar resultat 21 - 25 av 44 avhandlingar innehållade orden wafer bonding.

  1. 21. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing

    Författare :Markus Forsberg; Jörgen Olsson; Jyrki Molarius; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; chemical mechanical polishing; chemical mechanical planarization; silicon; silicon dioxide; front end; shallow trench isolation; deep trench isolation; bipolar transistor; BiCMOS; wafer bonding; Elektronik; Electronics; Elektronik;

    Sammanfattning : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. LÄS MER

  3. 22. Applications of Si1-xGex alloys for Ge devices and monolithic 3D integration

    Författare :Konstantinos Garidis; Per-Erik Hellström; Mikael Östling; Sten Vollebregt; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon; germanium; epitaxy; selective; pn junction; germanium on insulator; GOI; Ge PFET; bonding; monolithic; sequential; three dimensional; 3D; low temperature; Informations- och kommunikationsteknik; Information and Communication Technology;

    Sammanfattning : As the semiconductor industry moves beyond the 10 nm node, power consumption constraints and reduction of the negative impact of parasitic elements become important. Silicon germanium (Si1−xGex) alloys have been used to amplify the performance of Si based devices and integrated circuits (ICs) for decades. LÄS MER

  4. 23. Electrical Characterization of Novel Insulators in Metal-Insulator-Semiconductor Structures

    Författare :Anders Jauhiainen; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicon dioxide; MOS; Fowler-Nordheim injection; charge transport; MIS; wafer bonding; polycrystalline diamond; capacitance;

    Sammanfattning : This thesis comprises seven papers (A-G) and an extended introduction which puts them into context within a broader field of research. The papers deal with the electrical characterization of some different insulators and interfaces encountered within the realm of silicon based microelectronics. LÄS MER

  5. 24. Design and Characterization of RF-LDMOS Transistors and Si-on-SiC Hybrid Substrates

    Författare :Sara Lotfi; Jörgen Olsson; Örjan Vallin; Jean-Pierre Raskin; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; LDMOS; RF; losses; crosstalk; silicon carbide; Si-on-SiC hybrid substrate; wafer bonding; CMOS; Teknisk fysik med inriktning mot elektronik; Engineering Science with specialization in Electronics;

    Sammanfattning : With increasing amount of user data and applications in wireless communication technology, demands are growing on performance and fabrication costs. One way to decrease cost is to integrate the building blocks in an RF system where digital blocks and high power amplifiers then are combined on one chip. LÄS MER

  7. 25. Silicon Integrated HBV Frequency Multipliers for THz Applications

    Författare :Aleksandra Malko; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; frequency multipliers; Heterostrucutre Barrier Varactors HBVs ; THz sources; wafer bonding.; integrated circuits; heterogeneous integration; Compund semiconductors; epitaxial transfer; MICs;

    Sammanfattning : This thesis deals with integrated varactor diode circuits for terahertz (THz) applications. In particular hybrid, monolithic microwave integrated circuits (MMICs), and heterogeneous integration are explored for frequency multiplier applications. LÄS MER