Sökning: "Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging"

Hittade 1 avhandling innehållade orden Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging.

  1. 1. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Författare :Peng Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Sammanfattning : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. LÄS MER