Sökning: "chemical mechanical polishing"
Visar resultat 1 - 5 av 14 avhandlingar innehållade orden chemical mechanical polishing.
1. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing
Sammanfattning : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. LÄS MER
2. The influence of microstructure on mechanical and tribological properties of lamellar and compacted irons in engine applications
Sammanfattning : Lamellar graphite iron (LGI) is commonly used in diesel engine applications such as piston rings–cylinder liner where an excellent combination of physical and tribological properties is essential to avoid scuffing and bore polishing issues. The excellent tribological behaviour of LGI alloys is related to the graphite lamellas, which act as solid lubricant agents by feeding onto the tribosurfaces under sliding conditions. LÄS MER
3. Investigation of New Concepts and Solutions for Silicon Nanophotonics
Sammanfattning : Nowadays, silicon photonics is a widely studied research topic. Its high-index-contrast and compatibility with the complementary metal-oxide-semiconductor technology make it a promising platform for low cost high density integration. LÄS MER
4. Fabrication of Group IV Semiconductors on Insulator for Monolithic 3D Integration
Sammanfattning : The conventional 2D geometrical scaling of transistors is now facing many challenges in order to continue the performance enhancement while decreasing power consumption. The decrease in the device power consumption is related to the scaling of the power supply voltage (Vdd) and interconnects wiring length. LÄS MER
5. Epitaxy and characterization of SiGeC layers grown by reduced pressure chemical vapor deposition
Sammanfattning : Heteroepitaxial SiGeC layers have attracted immenseattention as a material for high frequency devices duringrecent years. The unique properties of integrating carbon inSiGe are the additional freedom for strain and bandgapengineering as well as allowing more aggressive device designdue to the potential for increased thermal budget duringprocessing. LÄS MER