Sökning: "direct bonding"
Visar resultat 1 - 5 av 52 avhandlingar innehållade orden direct bonding.
1. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding
Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER
2. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding
Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER
3. Silicon and Quartz Microengineering : Processing and Characterisation
Sammanfattning : Microengineering has developed a broad range of production techniques to reduce size, increase throughput, and reduce cost of electrical and mechanical devices. The miniaturisation has also entailed entirely new opportunities. LÄS MER
4. Plasma assisted low temperature semiconductor wafer bonding
Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER
5. Probing molecular adsorbates with core level spectroscopies : Electronic structure and bonding models
Sammanfattning : Resonantly excited X-ray emission spectroscopy has been applied to study the valence electronic structure of molecular adsorbates in an atom specific and orbital symmetry selective manner. In combination with ab initio cluster calculations, electronic structure and bonding models have been derived. LÄS MER