Sökning: "Örjan Vallin"

Hittade 4 avhandlingar innehållade orden Örjan Vallin.

1. 1. From Silicon to Quartz : Microstructure Technology Transfer for Increased Frequency Stability

   Författare :Örjan Vallin; Uppsala universitet; []
   Nyckelord :;

   Sammanfattning : .... LÄS MER

3. 2. Silicon and Quartz Microengineering : Processing and Characterisation

   Författare :Örjan Vallin; Peter Enoksson; Uppsala universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; silicon; quartz; microengineering; microstructure; MEMS; wafer bonding; direct bonding; adhesion quantification; Teknisk fysik; Engineering physics; Teknisk fysik;

   Sammanfattning : Microengineering has developed a broad range of production techniques to reduce size, increase throughput, and reduce cost of electrical and mechanical devices. The miniaturisation has also entailed entirely new opportunities. LÄS MER

4. 3. Fabrication and Characterization of Si-on-SiC Hybrid Substrates

   Författare :Ling-Guang Li; Jörgen Olsson; Örjan Vallin; Stefan Bengtsson; Uppsala universitet; []
   Nyckelord :hydrophilic wafer bonding; silicon on silicon carbide; hybrid substrate; oxygen out-diffusion; Engineering Science with specialization in Electronics; Teknisk fysik med inriktning mot elektronik;

   Sammanfattning : In this thesis, we are making a new approach to fabricate silicon on insulator (SOI). By replacing the buried silicon dioxide and the silicon handling wafer with silicon carbide through hydrophilic wafer bonding, we have achieved silicon on crystalline silicon carbide for the first time and silicon on polycrystalline silicon carbide substrates at 150 mm wafer size. LÄS MER

5. 4. Design and Characterization of RF-LDMOS Transistors and Si-on-SiC Hybrid Substrates

   Författare :Sara Lotfi; Jörgen Olsson; Örjan Vallin; Jean-Pierre Raskin; Uppsala universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; LDMOS; RF; losses; crosstalk; silicon carbide; Si-on-SiC hybrid substrate; wafer bonding; CMOS; Teknisk fysik med inriktning mot elektronik; Engineering Science with specialization in Electronics;

   Sammanfattning : With increasing amount of user data and applications in wireless communication technology, demands are growing on performance and fabrication costs. One way to decrease cost is to integrate the building blocks in an RF system where digital blocks and high power amplifiers then are combined on one chip. LÄS MER