Sökning: "deep submicron circuits"

Visar resultat 1 - 5 av 7 avhandlingar innehållade orden deep submicron circuits.

1. 1. The Impact of the Skin Effect on Deep Submicron Integrated Circuits

   Författare :Daniel Andersson; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : Since the first chip was manufactured in a CMOS technology there has been a drive to shrink dimensions of both wires and transistors. The reason is that down-scaling enables designs with more functionality and higher performance. However, with the 0.25um process, interconnects became as important as the gate delay. LÄS MER

3. 2. Modelling and Analysis of Interconnects for Deep Submicron Systems-on-Chip

   Författare :Dinesh Pamunuwa; KTH; []
   Nyckelord :delay and noise modelling in VLSI circuits; cross-talk; interconnect modelling; timing analysis; transfer function; on-chip bus; bandwidth maximization; throughput maximization; repeater insertion; wire optimization;

   Sammanfattning : The last few decades have been a very exciting period in thedevelopment of micro-electronics and brought us to the brink ofimplementing entire systems on a single chip, on a hithertounimagined scale. However an unforeseen challenge has croppedup in the form of managing wires, which have become the mainbottleneck in performance, masking the blinding speed of activedevices. LÄS MER

4. 3. Design, analysis and integration of mixed-signal systems for signal and power integrity

   Författare :Li-Rong Zheng; KTH; []
   Nyckelord :signal integrity; power distribution; interconnects; deep submicron circuits; system-on-chip; system-in-package; mixed signalsystem; single level integration;

   Sammanfattning : .... LÄS MER

5. 4. Power Estimation and Multi-Phase Clock Generation for the Deep Submicron Era

   Författare :Daniel Eckerbert; Chalmers tekniska högskola; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES;

   Sammanfattning : Scaling has been the driving force behind the immense development the field of electronics has seen over the last few decades. It has brought us from integrated circuits operating in the kilohertz range in the 1970s to the gigahertz range in just thirty years. LÄS MER

7. 5. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER