Sökning: "Hybrid interconnect"

Visar resultat 1 - 5 av 10 avhandlingar innehållade orden Hybrid interconnect.

1. 1. Study on electroabsorption modulators and grating couplers for optical interconnects

   Författare :Yongbo Tang; Urban Westergren; Dries Van Thourhout; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Photonic integrated circuit; optical interconnect; transmission line; traveling-wave; electro-absorption modulator; hybrid silicon evanescent platform; grating coupler; vertical coupling scheme; optical antenna; lag effect; polarization beam splitter; Photonics; Fotonik; SRA - ICT; SRA - Informations- och kommunikationsteknik;

   Sammanfattning : Decades of efforts have pushed the replacement of electrical interconnects by optical links to the interconnects between computers, racks and circuit boards. It may be expected that optical solutions will further be used for inter-chip and intra-chip interconnects with potential benefits in bandwidth, capacity, delay, power consumption and crosstalk. LÄS MER

3. 2. Reliable RFID Communication and Positioning System for Industrial IoT

   Författare :Chuanying Zhai; Hannu Tenhunen; Zhuo Zou; Jari Nurmi; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; 2.4-GHz UWB hybrid positioning; industrial IoT; MF-TDMA; QoS; reliable communication; RFID; Informations- och kommunikationsteknik; Information and Communication Technology;

   Sammanfattning : The Internet of Things (IoT) has the vision to interconnect everything of the physical world and the virtual world. Advanced automated and adaptive connectivity of objects, systems, and services is expected to be achieved under the IoT context, especially in the industrial environment. Industry 4. LÄS MER

4. 3. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Författare :Shuangxi Sun; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER

5. 4. Silicon Based Photonic Devices and Their Applications

   Författare :Qiang Li; Min Qiu; Geert Morthier; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Optics; Optik;

   Sammanfattning : The integration of modern electronic devices for information processing is rapidly ap-proaching an interconnect bottleneck. Silicon photonics can be a promising solution forcircumventing this bottleneck, as already being anticipated by many electronics manu-facturers including HP, IBM and Intel. LÄS MER

7. 5. Vertical-Cavity Surface-Emitting Lasers: Large Signal Dynamics and Silicon Photonics Integration

   Författare :Emanuel Haglund; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; vertical-cavity surface-emitting laser VCSEL .; silicon photonics; high-speed modulation; semiconductor lasers; optical interconnects; laser dynamics; large signal modulation; Heterogeneous integration;

   Sammanfattning : The GaAs-based vertical-cavity surface-emitting laser (VCSEL) is the standard light source in today's optical interconnects, due to its energy efficiency, low cost, and high speed already at low drive currents. The latest commercial VCSELs operate at data rates of up to 28 Gb/s, but it is expected that higher speeds will be required in the near future. LÄS MER