Sökning: "cohesive zone modelling"
Visar resultat 1 - 5 av 14 avhandlingar innehållade orden cohesive zone modelling.
1. On Cohesive Modelling of Carbon/Epoxy Composites : Delamination and Fibre Compressive Failure
Sammanfattning : Carbon Fibre Reinforced Polymers are widely used in engineering applications where weight saving and high mechanical performance are a key factors. However, an inheren tweakness of laminated CFRP:s is there relatively low resistance to delamination. Therst part of this thesis is devoted to extract cohesive laws associated with delamination. LÄS MER
2. Modelling of Delamination Growth in Composite Structures
Sammanfattning : Delaminations constitute an important damage and failure mode in polymeric composite laminates. In order to explicitly incorporate and model the delamination progression within a finite element analysis, the meso-modelling concept is applied in the present work. The laminate is thereby represented by separate layers connected with interfaces. LÄS MER
3. Modelling of large deformation crack propagation based on the extended finite element method
Sammanfattning : This thesis is concerned with the finite element modelling of large deformation crack propagation, based on the extended finite element methodology. The benefit from this approach is the possibility of locally enriching the finite element space, i.e. to add a priori knowledge about the local behaviour of the solution in order to improve accuracy. LÄS MER
4. Modelling of intergranular stress corrosion cracking mechanism : Du som saknar dator/datorvana kan kontakta [email protected] för information
Sammanfattning : When assessing nuclear power plant life, stress corrosion cracking (SCC) plays an important role. Stress corrosion cracking in nuclear power plants is well recognized and heavily researched. Still due to its complicated nature it is not completely understood. There are many different damage mechanisms behind SCC. LÄS MER
5. Modelling and Reliability Assessment of Microsystem Interconnections
Sammanfattning : With the continuous increase of packaging density, the electronic component size and, in particular, the thickness of the involved interconnections decrease significantly. In addition, the microsystem interconnects usually include even finer internal structures. LÄS MER