Sökning: "high packaging ratio"

Visar resultat 11 - 15 av 25 avhandlingar innehållade orden high packaging ratio.

1. 11. Towards Unconventional Applications of Wire Bonding

   Författare :Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. LÄS MER

3. 12. 3D Integration of Carbon Based Electronics

   Författare :Wei Mu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. LÄS MER

4. 13. Graphene Heat Spreaders for Electronics Thermal Management Applications

   Författare :Yong Zhang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; test platform; heat spreader.; transfer; Graphene; thermal management;

   Sammanfattning : Graphene shows great potential for applications in electronics due to its outstanding physical properties such as extremely high electron mobility, high thermal conductivity, high Young’s modulus and very high surface-to-volume ratio. Among these attractive properties, the high intrinsic thermal conductivity is a critical advantage for the application of graphene in electronics to alleviate heat dissipation problems. LÄS MER

5. 14. Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors

   Författare :Muhammad Amin; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; carbon nanotubes; Integrated capacitors; vertically aligned carbon nanofibers; Interconnects; PECVD; Interdigitated micro-supercapacitors;

   Sammanfattning : The constant miniaturization and steady performance improvement of electronics devices have generated innovative ideas such as internet of thing (IoT), which also includes devices with integrated energy sources. The high performance is conceived by the high density of the devices on a chip leading to a high density of interconnects, to connect these devices to outside world. LÄS MER

7. 15. Preparation and properties of dried nanfibrillated cellulose and its nanocomposites

   Författare :Christian Eyholzer; Mirja Illikainen; Luleå tekniska universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Trä och bionanokompositer; Wood and Bionanocomposites;

   Sammanfattning : The production of fully degradable nanocomposites with biopolymers as matrix and cellulose nanofibrils with high aspect ratios as reinforcement is still a challenging task. Also, due to the large amount of hydroxyl groups on the surface of these nanofibrils, they tend to irreversibly agglomerate during drying. LÄS MER