Sökning: "wire optimization"
Visar resultat 11 - 15 av 21 avhandlingar innehållade orden wire optimization.
11. Efficient high-speed on-chip global interconnects
Sammanfattning : The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. LÄS MER
12. Integration of Surface Acoustic Wave and Microfluidic Technologies for Liquid-Phase Sensing Applications
Sammanfattning : This thesis discusses a new concept for construction of a novel SAW in-liquid sensor employing surface acoustic wave resonance (SAR) in a one-port configuration. In this concept, the reflective gratings of a one-port SAW resonator are employed as mass loading-sensing elements, while the SAW transducer is protected from the measurement environment, reducing power losses significantly. LÄS MER
13. A Central Rapidity Straw Tracker and Measurements on Cryogenic Components for the Large Hadron Collider
Sammanfattning : This thesis is divided into two parts in which two different aspects of the Large Hadron Collider (LHC) Project are discussed. The first part describes the design of a transition radiation tracker (TRT) for the inner detector in ATLAS. In particular, the barrel part was studied in detail. The barrel TRT consists of 52 544 1. LÄS MER
14. Control of Systems with Limited Capacity
Sammanfattning : Virtually all real life systems are such that they present some kind of limitation on one or many of its variables, physical quantities. These systems are designated in this thesis as systems with limited capacity. This work is treating control related problems of a subclass of such systems, where the limitation is a critical factor. LÄS MER
15. Design of efficient high-speed on-chip global interconnects
Sammanfattning : The development of integrated circuits is continuously moving towards a System-on Chip realization where global interconnects, connecting circuit blocks separated by a long distance, have been considered a showstopper for process scaling due to their RC-delays. Our knowledge today is that high-speed interconnects must be described by models which include not only R and C, but also inductance and skin effect. LÄS MER