Sökning: "vibration mitigation"

Visar resultat 1 - 5 av 11 avhandlingar innehållade orden vibration mitigation.

  1. 1. Vibration mitigation of high-speed railway bridges : Application of damping devices in theory and practice

    Författare :Sarah Tell; Raid Karoumi; Andreas Andersson; Ülker-Kaustell Mahir; José Maria Goicolea; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; vibration mitigation; high-speed railway bridges; damping devices; retrofit; numerical analysis; hybrid simulation; field experiment; vibrationsdämpning; järnvägsbroar för höghastighetståg; dämpare; eftermonteringsmetod; numerisk analys; hybridsimulering; fältförsök; Structural Engineering and Bridges; Bro- och stålbyggnad;

    Sammanfattning : The dynamic response of railway bridges is an important aspect to consider, as the repetitive loading from passing trains may result in excessive vibrations of the bridge deck. Several design criteria are developed in order to assure the structural safety and passenger comfort during train crossings of a bridge. LÄS MER

  2. 2. Vibration mitigation of high-speed railway bridges : Application of fluid viscous dampers

    Författare :Sarah Tell; Raid Karoumi; Ülker-Kaustell Mahir; Andreas Andersson; Bill F. Jr. Spencer; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; dynamics; vibration mitigation; railway bridge; high-speed trains; bridge deck acceleration; passive damping; fluid viscous dampers; retrofit; dynamik; vibrationsdämpning; järnvägsbro; höghastighetståg; brobaneacceleration; passiv dämpning; viskösa dämpare; eftermontering; Byggvetenskap; Civil and Architectural Engineering;

    Sammanfattning : At the moment of writing, an expansion of the Swedish railway network has started, by constructions of new lines for high-speed trains. The aim is to create a high-speed connection between the most populous cities in Sweden - Stockholm, Göteborg and Malmö, and the rest of Europe. LÄS MER

  3. 3. Countermeasures against railway ground and track vibrations

    Författare :Robert Hildebrand; KTH; []
    Nyckelord :ground vibration; vibration screen; track vibration; railway vibration; seismic barrier;

    Sammanfattning : Railway track and ground vibrations are considered, with anemphasis on methods of mitigation ("countermeasures"), forapplication to wayside disturbance problems.Original field measurements from two sites in Sweden, aswell as borrowed measurements from Norway, provide vibrationresults at many points on the track, on and underneath theground surface, for a variety of trains, both with and withoutcountermeasures in-place. LÄS MER

  4. 4. Harmonic Mitigation in Traction Drives

    Författare :Hans Bängtsson; Industriell elektroteknik och automation; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; hydraulics; Mechanical engineering; converter; line interference; track circuit; Railway signalling system; vacuum technology; vibration and acoustic engineering; Maskinteknik; hydraulik; vakuumteknik; vibrationer; akustik;

    Sammanfattning : In railway traffic the low friction between wheel and rail causes long braking distances, normally much longer than the sight distance of the driver, i.e. if the driver starts the braking when a problem on the track is discovered, it might be too late to brake the train. Therefore, safe railway traffic can not only rely on the driver. LÄS MER

  5. 5. Wafer Bonding for Spaceflight Applications : Processing and Characterisation

    Författare :Kerstin Jonsson; Maaike Visser-Taklo; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; Engineering physics; Teknisk fysik;

    Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER