Sökning: "vibration mitigation"
Visar resultat 1 - 5 av 11 avhandlingar innehållade orden vibration mitigation.
1. Vibration mitigation of high-speed railway bridges : Application of damping devices in theory and practice
Sammanfattning : The dynamic response of railway bridges is an important aspect to consider, as the repetitive loading from passing trains may result in excessive vibrations of the bridge deck. Several design criteria are developed in order to assure the structural safety and passenger comfort during train crossings of a bridge. LÄS MER
2. Vibration mitigation of high-speed railway bridges : Application of fluid viscous dampers
Sammanfattning : At the moment of writing, an expansion of the Swedish railway network has started, by constructions of new lines for high-speed trains. The aim is to create a high-speed connection between the most populous cities in Sweden - Stockholm, Göteborg and Malmö, and the rest of Europe. LÄS MER
3. Countermeasures against railway ground and track vibrations
Sammanfattning : Railway track and ground vibrations are considered, with anemphasis on methods of mitigation ("countermeasures"), forapplication to wayside disturbance problems.Original field measurements from two sites in Sweden, aswell as borrowed measurements from Norway, provide vibrationresults at many points on the track, on and underneath theground surface, for a variety of trains, both with and withoutcountermeasures in-place. LÄS MER
4. Harmonic Mitigation in Traction Drives
Sammanfattning : In railway traffic the low friction between wheel and rail causes long braking distances, normally much longer than the sight distance of the driver, i.e. if the driver starts the braking when a problem on the track is discovered, it might be too late to brake the train. Therefore, safe railway traffic can not only rely on the driver. LÄS MER
5. Wafer Bonding for Spaceflight Applications : Processing and Characterisation
Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER