Sökning: "vertical integration"

Visar resultat 11 - 15 av 118 avhandlingar innehållade orden vertical integration.

  1. 11. VCSEL Cavity Engineering for High Speed Modulation and Silicon Photonics Integration

    Författare :Emanuel Haglund; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; high-speed modulation; on-chip laser source; vertical-cavity surface-emitting laser VCSEL ; semiconductor lasers; optical interconnects; large signal modulation; laser dynamics; heterogeneous integration; vertical-cavity silicon-integrated laser VCSIL ; silicon photonics;

    Sammanfattning : The GaAs-based vertical-cavity surface-emitting laser (VCSEL) is the standard light source in today's optical interconnects, due to its energy efficiency, low cost, and high speed already at low drive currents. The latest commercial VCSELs operate at data rates of up to 28 Gb/s, but it is expected that higher speeds will be required in the near future. LÄS MER

  3. 12. VCSEL Equivalent Circuits and Silicon Photonics Integration

    Författare :Alexander Grabowski; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; vertical-cavity surface-emitting laser; light source integration; equivalent circuit; silicon photonics; sensing; optical interconnects;

    Sammanfattning : The vertical-cavity surface-emitting laser (VCSEL) is a light source of great importance for numerous industrial and consumer products. The main application areas are datacom and sensing. LÄS MER

  4. 13. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

    Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

    Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER

  5. 14. VCSEL and Integration Techniques for Wavelength-Multiplexed Optical Interconnects

    Författare :Mehdi Jahed; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; wavelength setting; optical interconnects; mode control; vertical-cavity surface-emitting laser; flip-chip integration; wavelength-division-multiplexing; silicon photonics;

    Sammanfattning : GaAs-based vertical-cavity surface-emitting lasers (VCSELs) are dominating short-reach optical interconnects (OIs) due to their high modulation speed, low power consumption, circular output beam and low fabrication cost. Such OIs provide the high bandwidth connectivity needed for interconnecting servers and switches in data centers. LÄS MER

  7. 15. Institutional arrangements and competitive posture : effects of company structures in the commercial printing industry

    Författare :Thomas Mejtoft; Nils Enlund; Robert G. Picard; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; business strategy; cooperation; customer value; institutional arrangements; printing industry; vertical integration; Industrial organisation; administration and economics; Industriell organisation; administration och ekonomi; Media and communication studies; Medie- och kommunikationsvetenskap;

    Sammanfattning :  The research objective of this dissertation is to investigate the impact of institutional arrangements, with respect to vertical integration and cooperation, on competitive advantages within the commercial printing industry, with specific focus on digital printing. This dissertation comprises six research papers, based on four qualitative case studies and a quantitative survey study, all carried out in Sweden in the years 2004-2008. LÄS MER