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Hittade 3 avhandlingar som matchar ovanstående sökkriterier.

  1. 1. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Författare :Li-Han Hsu; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER

  3. 2. Flip chip for high frequency applications : materials aspects

    Författare :Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

    Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER

  4. 3. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

    Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

    Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER