Sökning: "transfer wafer bonding"

Visar resultat 1 - 5 av 14 avhandlingar innehållade orden transfer wafer bonding.

  1. 1. Wafer-level heterogeneous integration of MEMS actuators

    Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  3. 2. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Författare :Niklaus Frank; KTH; []
    Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

  4. 3. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  5. 4. Towards Unconventional Applications of Wire Bonding

    Författare :Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. LÄS MER

  7. 5. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

    Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER