Sökning: "through silicon vias TSVs"

Hittade 3 avhandlingar innehållade orden through silicon vias TSVs.

  1. 1. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER

  3. 2. MEMS-based electrochemical gas sensors and wafer-level methods

    Författare :Hithesh K Gatty; Göran Stemme; Roxhed Niclas; Anita Lloyd Spetz; KTH; []
    Nyckelord :MEMS; gas sensors; electrochemical; nitric oxide; hydrogen sulphide; nafion; nano;

    Sammanfattning : This thesis describes novel microel ectromechanical system (MEMS) based electrochemical gas sensors and methods of fabrication.This thesis presents the research in two parts. In the first part, a method to handle a thin silicon wafer using an electrochemically active adhesive is described. LÄS MER

  4. 3. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Författare :Shuangxi Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER