Sökning: "thermal-mechanical"
Visar resultat 1 - 5 av 18 avhandlingar innehållade ordet thermal-mechanical.
1. Modeling and Testing of Insulation Degradation due to Dynamic Thermal Loading of Electrical Machines
Sammanfattning : Electrical machines in electrified vehicles are subjected to dynamic loadings at different driving conditions, which results in dynamic temperatures. The aging of the Electrical Insulation System (EIS) in electrical machines is caused by these dynamic temperatures, namely high average temperatures and temperature cycles. LÄS MER
2. Numerical investigation on the formation mechanism of residual stress in metal cutting
Sammanfattning : Residual stress can be introduced unintentionally into the workpiece with various magnitudes and distributions through all manufacturing processes. These stresses have a significant effect upon the performance of the final component. LÄS MER
3. Simulations of Semi-Crystalline Polymers and Polymer Composites in order to predict Electrical, Thermal, Mechanical and Diffusion Properties
Sammanfattning : Several novel computer simulation models were developed for predicting electrical, mechanical, thermal and diffusion properties of materials with complex microstructures, such as composites, semi-crystalline polymers and foams. A Monte Carlo model for simulating solvent diffusion through spherulitic semicrystalline polyethylene was developed. LÄS MER
4. Thorium fuels for light water reactors - steps towards commercialization
Sammanfattning : Thorium-containing nuclear fuel is proposed as a means of gaining a number of benefits in the operation of light water reactors, some related to the nuclear properties of thorium and some related to the material properties of thorium dioxide. This thesis aims to investigate some of these benefits and to widen the knowledge base on thorium fuel behaviour, in order to pave the way for its commercial use. LÄS MER
5. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER