Sökning: "thermal interface material"
Visar resultat 21 - 25 av 129 avhandlingar innehållade orden thermal interface material.
21. Graphene Heat Spreaders for Electronics Thermal Management Applications
Sammanfattning : Graphene shows great potential for applications in electronics due to its outstanding physical properties such as extremely high electron mobility, high thermal conductivity, high Young’s modulus and very high surface-to-volume ratio. Among these attractive properties, the high intrinsic thermal conductivity is a critical advantage for the application of graphene in electronics to alleviate heat dissipation problems. LÄS MER
22. Failure mechanisms in APS and SPS thermal barrier coatings during cyclic oxidation and hot corrosion
Sammanfattning : Thermal Barrier Coatings (TBCs) are advanced material systems that are being used in the hot sections of gas turbines such as combustor, turbine blades, and vanes. The top ceramic coating in TBCs provides insulation against the hot gases and the intermediate metallic bond coat provides oxidation and corrosion resistance to the underlying turbine components. LÄS MER
23. Optimisation of Machining Operations by means of Finite Element Method and Tailored Experiments
Sammanfattning : Traditionally, costly experimental procedures have been followed in industry to optimise the machining operations to secure the maximum efficiency in production line, while the functional requirements of the machined surfaces are fulfilled. In recent years, development of robust numerical techniques such as Finite Element Method (FEM) and advances in computing capacity of computers have made it possible to simulate the machining operations under operational conditions. LÄS MER
24. Fundamental Characterization of Low Dimensional Carbon Nanomaterials for 3D Electronics Packaging
Sammanfattning : Transistor miniaturization has over the last half century paved the way for higher value electronics every year along an exponential pace known as 'Moore's law'. Now, as the industry is reaching transistor features that no longer makes economic sense, this way of developing integrated circuits (ICs) is coming to its definitive end. LÄS MER
25. Partitioned methods for time-dependent thermal fluid-structure interaction
Sammanfattning : The efficient simulation of thermal interaction between fluids and structures is crucial in the design of many industrial products, e.g. turbine blades or rocket nozzles. LÄS MER