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Visar resultat 1 - 5 av 129 avhandlingar som matchar ovanstående sökkriterier.

1. 1. Solder Matrix Fiber Composite Thermal Interface Materials

   Författare :Josef Hansson; Chalmers tekniska högskola; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal management; composite materials; solder; thermal interface material;

   Sammanfattning : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. LÄS MER

3. 2. Polyethylene – metal oxide particle nanocomposites for future HVDC cable insulation : From interface tailoring to designed performance

   Författare :Dongming Liu; Ulf Gedde; Mikael Hedenqvist; Richard Olsson; Linda Schadler; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; HVDC; electrical insulation; core-shell nanoparticles; surface modification; silane chemistry; nanocomposites; polyethylene; adsorption; long-term stability; interface; particle dispersion; cavitation; conductivity; HVDC; elektrisk isolation; ytmodifiering; silankemi; nanokompositer; polyeten; adsorption; långtidsstabilitet; ytskikt; partikeldispergering; kavitation; ledningsförmåga; Fiber- och polymervetenskap; Fibre and Polymer Science;

   Sammanfattning : Low-density polyethylene (LDPE) nanocomposites containing metal oxide nanoparticles are considered as promising candidates for insulating materials in future high-voltage direct-current (HVDC) cables. The significant improvement in dielectric properties compared with unfilled polymer is attributed to the large and active interface between the nanoparticles and the polymer. LÄS MER

4. 3. Fabrication and Characterisation of Carbon Nanotube Array Thermal Interface Materials

   Författare :ANDREAS NYLANDER; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; carbon nanotubes; reliability test; thermal management; thermal interface material; chemical functionalization;

   Sammanfattning : The performance of electronic devices has long been limited by thermal dissipation which will result in device failure if not handled properly. The next generation of integrated circuit (IC) devices will feature new packaging technologies like heterogeneous integration as well as 3D stacking which entails additional emphasis on the thermal management solutions employed. LÄS MER

5. 4. Thermal Barrier Coatings : Failure Mechanisms and Life Prediction

   Författare :Krishna Praveen Jonnalagadda; Ru Lin Peng; Xin-Hai Li; Robert Eriksson; Nicholls John; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : Thermal barrier coatings (TBCs) use in the hot sections of gas turbine engine enables them to run at higher temperatures, and as a consequence, achieve higher thermal efficiency. For full operational exploitation of TBCs, understanding their failure and knowing the service life is essential. LÄS MER

7. 5. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

   Författare :Xin Luo; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

   Sammanfattning : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER