Sökning: "substrate integrated waveguides"
Visar resultat 1 - 5 av 13 avhandlingar innehållade orden substrate integrated waveguides.
1. Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems
Sammanfattning : This thesis presents various integrated antenna solutions for different types of systems and applications, e.g. wireless sensors, broadband handsets, advanced base stations, MEMS-based reconfigurable front-ends, automotive anti-collision radars, and large area electronics. LÄS MER
2. High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications
Sammanfattning : Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. LÄS MER
3. Nanophotonic devices in thin film lithium niobate
Sammanfattning : Photonic devices play a fundamental role in today’s society and are a central building blocks for numerous applications, ranging from modern internet to sensing and manufacturing, and photonics is foreseen to be the backbone of future quantum internet and quantum communication systems thanks to the long coherence time of light. At variance with electronic integrated circuits, where silicon has been the material of election for many decades, in the case of photonic integrated circuits (PICs) there are numerous options available for the material substrate. LÄS MER
4. Fabrication of Integrated HBV Multipliers for THz Generation
Sammanfattning : The main objective of this licentiate thesis is to demonstrate silicon integrated HBV frequency multipliers for THz generation with RF performance comparable with InP technology. The choice of silicon is motivatedby better thermal and mechanical properties, cost and ease of integration compared to III-V semiconductor substrates. LÄS MER
5. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER