Sökning: "standard wire bonding technology"
Hittade 4 avhandlingar innehållade orden standard wire bonding technology.
1. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems
Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER
2. Integration and Fabrication Techniques for 3D Micro- and Nanodevices
Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER
3. CMOS High Frequency Circuits for Spin Torque Oscillator Technology
Sammanfattning : Spin torque oscillator (STO) technology has a unique blend of features, including but not limited to octave tunability, GHz operating frequency, and nanoscaled size, which makes it highly suitable for microwave and radar applications. This thesis studies the fundamentals of STOs, utilizes the state-of-art STO's advantages, and proposes two STO-based microwave systems targeting its microwave applications and measurement setup, respectively. LÄS MER
4. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER