Sökning: "sequential build-up"
Visar resultat 1 - 5 av 13 avhandlingar innehållade orden sequential build-up.
1. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER
2. High frequency electronic packaging and components : characterization, simulation, materials and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. LÄS MER
3. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER
4. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates
Sammanfattning : .... LÄS MER
5. Contactless Test of Circuit Boards
Sammanfattning : Electronics are still continuing to respond to the small-feature size requirement for economical, performance and environmental benefits.Due to the non-idealities in the manufacturing process of circuit boards, electronics production yield is never 100 %. LÄS MER