Sökning: "packaging material"

Visar resultat 1 - 5 av 184 avhandlingar innehållade orden packaging material.

1. 1. Shear Fracture and Delamination in Packaging Materials : A study of Experimental Methods and Simulation Techniques

   Författare :Md. Shafiqul Islam; Sharon Kao-Walter; Christian Johansson; Johan Tryding; Blekinge Institute of Technology; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Package opening; Shear test specimen; Stress intensity factor; Finite Element simulation; Scanning electron microscopy; Polymers; Interlaminar shear delamination;

   Sammanfattning : Packages are the means of preservation, distribution and convenience of use for food, medicine and other consumer products. Package opening is becoming complicated in many cases because of cutting cost in design and production of opening techniques. LÄS MER

3. 2. Food Packaging for Sustainable Development

   Författare :Helén Williams; Fredrik Wikström; Ole Jørgen Hanssen; Karlstads universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Packaging; sustainable development; service perspective; food losses; food waste; consumer interaction; life cycle assessment - LCA; consumer value; Miljö- och energisystem; Environmental and Energy Systems;

   Sammanfattning : Packaging has been on the environmental agenda for decades. It has been discussed and debated within the society mainly as an environmental problem. Production, distribution and consumption of food and drinks contribute significant to the environmental impact. However, consumers in the EU waste about 20% of the food they buy. LÄS MER

4. 3. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

   Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

   Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

5. 4. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

   Författare :Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER

7. 5. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

   Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

   Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER