Visar resultat 1 - 5 av 17 avhandlingar innehållade ordet oxygen-plasma.
Sammanfattning : .... LÄS MER
2. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding
Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER
Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER
Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER
5. Loss and recovery of hydrophobicity of polydimethylsiloxane after exposure to electrical discharges
Sammanfattning : Silicone rubber based on polydimethylsiloxane is used ashigh voltage outdoor insulation, due to its ability to preservethe hydrophobic surface properties during service and evenregain hydrophobicity after exposure to electrical discharges.The underlying processes for the hydrophobic recovery arediffusion of low molar mass siloxanes from the bulk to thesurface and reorientation by conformational changes ofmolecules in the surface region. LÄS MER