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Visar resultat 1 - 5 av 37 avhandlingar som matchar ovanstående sökkriterier.
1. From Macro to Nano : Electrokinetic Transport and Surface Control
Sammanfattning : Today, the growing and aging population, and the rise of new global threats on human health puts an increasing demand on the healthcare system and calls for preventive actions. To make existing medical treatments more efficient and widely accessible and to prevent the emergence of new threats such as drug-resistant bacteria, improved diagnostic technologies are needed. LÄS MER
2. Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft : A Multifunctional Microsystem Approach
Sammanfattning : This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. LÄS MER
3. A Fully Integrated Microneedle-based Transdermal Drug Delivery System
Sammanfattning : Patch-based transdermal drug delivery offers a convenient way to administer drugs without the drawbacks of standard hypodermic injections relating to issues such as patient acceptability and injection safety. However, conventional transdermal drug delivery is limited to therapeutics where the drug can diffuse across the skin barrier. LÄS MER
4. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER
5. Modelling and Reliability Assessment of Microsystem Interconnections
Sammanfattning : With the continuous increase of packaging density, the electronic component size and, in particular, the thickness of the involved interconnections decrease significantly. In addition, the microsystem interconnects usually include even finer internal structures. LÄS MER