Sökning: "microsystem interconnection"

Visar resultat 1 - 5 av 6 avhandlingar innehållade orden microsystem interconnection.

  1. 1. Modelling and Reliability Assessment of Microsystem Interconnections

    Författare :Yan Zhang; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; cohesive zone model; discontinuous regularization; Micropolar theory; homogenization; microsystem interconnection;

    Sammanfattning : With the continuous increase of packaging density, the electronic component size and, in particular, the thickness of the involved interconnections decrease significantly. In addition, the microsystem interconnects usually include even finer internal structures. LÄS MER

  3. 2. Reliability and applications of adhesives for microsystem packaging

    Författare :Zhimin Mo; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrically Conductive Adhesives; Finite Element Modeling; Reliability; Stress Analysis; Low Cycle Fatigue; Thermomechanical Fatigue; Encapsulation; Interconnection;

    Sammanfattning : The electronics industry is one of the most dynamic, fascinating and important industries. Polymeric adhesives are widely used in electronics packaging and play a critical role. LÄS MER

  4. 3. Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications

    Författare :Liqiang Cao; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesion strength; curing degree and curing temperature; moisture effect; flip chip; anisotropic conductive adhesives; reliability;

    Sammanfattning : There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low bonding temperature and fine-pitch capability are the major advantages of conducting adhesive technology. LÄS MER

  5. 4. Bringing Silicon Microsystems to Space : Manufacture, Performance, and Reliability

    Författare :Johan Köhler; Gert Andersson; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Space technology; Rymdteknik; Space engineering; Rymdteknik; teknisk fysik med inriktningen mikrosystemteknik; engineering science with specialization in microsystems technology;

    Sammanfattning : The incorporation of extremely compact multifunctional microsystems is a highly profitable long-term approach in spacecraft design. These systems bring substantial launch-cost reductions, and enable exciting space exploration and science missions.Silicon microsystems technology is an adequate choice for the multifunctional microsystem development. LÄS MER

  7. 5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Författare :Shuangxi Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER