Sökning: "liu chen"

Visar resultat 1 - 5 av 40 avhandlingar innehållade orden liu chen.

  1. 1. Excitonic Effects and Energy Upconversion in Bulk and Nanostructured ZnO

    Författare :Shula Chen; Irina Buyanova; Weimin Chen; Detlev M. Hofmann; Linköpings universitet; []
    Nyckelord :;

    Sammanfattning : Zinc Oxide (ZnO), a II-VI wurtzite semiconductor, has been drawing enormous research interest for decades as an electronic material for numerous applications. It has a wide and direct band gap of 3.37eV and a large exciton binding energy of 60 meV that leads to intense free exciton (FX) emission at room temperature. LÄS MER

  3. 2. Image dipoles and polarons in organic semiconductors

    Författare :Yongzhen Chen; Mats Fahlman; Xianjie Liu; Yiqiang Zhan; Linköpings universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Organic electronics; Interface dipole; Polaron; Conjugated polymer; Photoelectron spectroscopy; N-type doping; Electron transport material;

    Sammanfattning : The rapid development of organic electronics depends on the synthesis of new π-conjugated molecules/polymers and the exploration of fundamental physics. However, most of the efforts have been concentrated on the former, leading to a lack of thorough understanding of many important concepts, which will become the ultimate limiting factor for overall performance and applications. LÄS MER

  4. 3. Excitonic effects in ZnO

    Författare :Shula Chen; Irina Buyanova; Weimin Chen; Ivan Ivanov; Linköpings universitet; []
    Nyckelord :;

    Sammanfattning : Zinc Oxide (ZnO) is an extensively researched II-VI wide bandgap semiconductor material. As a promising material for future optoelectronic and spintronic applications, it continues to attract enormous amount of interest. LÄS MER

  5. 4. Adhesion characterization and reliability modelling for system-in-a-package using a liquid crystal polymer substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER

  7. 5. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER