Sökning: "light-weight design"

Visar resultat 1 - 5 av 43 avhandlingar innehållade orden light-weight design.

  1. 1. Process development for investment casting of thin-walled components : Manufacturing of light weight components

    Författare :Mohsin Raza; Björn Fagerström; Jarfors Anders; Mälardalens högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Investment casting; fluidity; thin sections; porosity; grain structure; turbine blades and Niyama criterion; Innovation and Design; innovation och design;

    Sammanfattning : Manufacturing processes are getting more and more complex with increasing demands of advanced and light weight engineering components, especially in aerospace industry. The global requirements on lower fuel consumption and emissions are increasing the demands in lowering weight of cast components. LÄS MER

  3. 2. Characterisation of Time-dependent Statistical Failure of Fibre Networks : Applications for Light-weight Structural Composites

    Författare :Amanda Mattsson; Tetsu Uesaka; Christina Dahlström; Sören Östlund; Mittuniversitetet; []
    Nyckelord :;

    Sammanfattning : The future of a sustainable society requires that materials not only be renewable, but also leave as small a carbon foot-printin the environment as possible. One such product is light-weight composite material for transportation packages. Cellulose fibres have been and will continue to be ideal for this purpose. LÄS MER

  4. 3. Laser welding of ultra-high strength steel and a cast magnesium alloy for light-weight design

    Författare :Karl Fahlström; Lars-Erik Svensson; Leif Karlsson; Michael Rethmeier; Högskolan Väst; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Laser welding; ultra-high strength steel; cast magnesium alloy; light-weight design; automotive industry; distortion; porosity; Production Technology; Produktionsteknik; Manufacturing and materials engineering; Produktions- och materialteknik;

    Sammanfattning : There is a strong industrial need for developing robust and flexible manufacturing methods for future light-weight design. Better performing, environmental friendly vehicles will gain competitive strength from using light weight structures. LÄS MER

  5. 4. Structural-acoustic vibrations in wooden assemblies : Experimental modal analysis and finite element modelling

    Författare :Åsa Bolmsvik; Torbjörn Ekevik; Andreas Linderholt; Anders Brandt; Anders Ågren; Linnéuniversitetet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; wooden framed structure; light weight buildings; multi-storey; flanking transmission; junction; vibration distribution; impact noise; damping; elastomers; finite element analysis; experimental modal analysis; FRF; trästomme; träkonstruktion; träbyggnad; flervåningshus; EMA; FEM; flanktransmission; koppling; knutpunkt; vibrationsspridning; stomljud; stegljud; dämpning; elastomerer; finit elementmetod; experimentell modalanalys; accelerationsmätning; frekvensresponsfunktion; modalanalys;

    Sammanfattning : This doctoral thesis concerns flanking transmission in light weight, wooden multi-storey buildings within the low frequency, primarily 20-120 Hz. The overall aim is to investigate how the finite element method can contribute in the design phase to evaluate different junctions regarding flanking transmission. LÄS MER

  7. 5. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Författare :Li-Han Hsu; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER