Sökning: "lead-free solder"

Visar resultat 1 - 5 av 9 avhandlingar innehållade orden lead-free solder.

  1. 1. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

    Författare :Sun Peng; Chalmers University of Technology; []
    Nyckelord :Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

    Sammanfattning : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. LÄS MER

  2. 2. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Författare :Peng Sun; Chalmers University of Technology; []
    Nyckelord :Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Sammanfattning : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. LÄS MER

  3. 3. Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

    Författare :Cristina Andersson; Chalmers University of Technology; []
    Nyckelord :Reliability.; Isothermal mechanical fatigue; Tensile tests; Mechanical behavior; Electronics; Thermal fatigue; Lead-free solders; Low cycle fatigue;

    Sammanfattning : The ever increasing amount of electronic waste, most of which ends up in landfills, has become a serious worldwide concern. In addition to this, the fact that Pb is highly toxic and harmful to humans has lead to the ban of this element from the electronics industry. LÄS MER

  4. 4. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Författare :Xin Luo; Chalmers University of Technology; []
    Nyckelord :thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Sammanfattning : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER

  5. 5. An Electron Microscopy Study on Materials in Electronic Packaging

    Författare :Lilei Ye; Chalmers University of Technology; []
    Nyckelord :MOS; conductive adhesives; Cu7Sn6; microstructure; SEM; lead-free solders; TEM; crystal structure; Cu6Sn5; modulation structure;

    Sammanfattning : This thesis is concerned with an investigation of the microstructure on materials in electronic packaging. The materials include Ag-filled conductive adhesives, Sn-Ag-based lead free solders and metal-oxide semiconductors. LÄS MER