Sökning: "interfacial reaction"

Visar resultat 6 - 10 av 45 avhandlingar innehållade orden interfacial reaction.

  1. 6. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

    Författare :Sun Peng; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

    Sammanfattning : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. LÄS MER

  3. 7. The synthesis, surface modification and use of metal-oxide nanoparticles in polyethylene for ultra-low transmission-loss HVDC cable insulation materials

    Författare :Amir Masoud Pourrahimi; Ulf W. Gedde; Alexander Bismarck; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; polyethylene; metal-oxide nanoparticles; heat treatment; surface coating; humidity resistance; interfacial adhesion; nanocomposite; HVDC insulation; polyeten; metalloxid nanopartiklar; värmebehandling; ytmodifiering av partiklarna; fukt inverkan; gränsskiktsvidhäftning; nanokomposit; HVDC isolering; Fiber- och polymervetenskap; Fibre and Polymer Science;

    Sammanfattning : Polyethylene composites which contain low concentrations of metal-oxide nanoparticles e.g. ZnO and MgO are emerging materials for the use in insulations of extruded high-voltage direct-current (HVDC) cables. LÄS MER

  4. 8. Interfacial Phenomena in Two-Phase systems: Emulsions and slag Foaming

    Författare :Abha Kapilashrami; Seshadri Seetharaman; Bridget Harris; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; film formation; o w emulsion; substrate effect; slag forming; Materialvetenskap; Materials science; Teknisk materialvetenskap;

    Sammanfattning : In the present work studies were performed to provide understanding for further model development of the two-phase phenomena, film formation from o/w emulsions and slag foaming.The drying of o/w emulsions of different oil viscosities on hydrophobic and hydrophilic substrates was studied. LÄS MER

  5. 9. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Författare :Peng Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Sammanfattning : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. LÄS MER

  7. 10. Thermal evaporation of small molecules-A study of interfacial, bulk and device properties for molecular electronics

    Författare :Måns Andreasson; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Organic semiconductors; OLED; UPS; OLET; ITO; molecule solid interfaces; OFET; CuPc; PTCDA;

    Sammanfattning : Electronic devices based on organic materials have recently become an emerging technology for many applications. Promising aspects are the compatibility with almost any substrate and low cost processing methods. LÄS MER