Sökning: "interfacial reaction"

Visar resultat 1 - 5 av 37 avhandlingar innehållade orden interfacial reaction.

  1. 1. Contacts on Silicon Carbide by Use of Nickel and Tantalum ---Preparation and Characterisation

    Författare :Yu Cao; [2007]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Keywords: Silicon Carbide; Metal Contact; Thin Films; Preferential Etching; Interfacial Reaction; effect; Nickel; Tantalum; #955; Depth Profile; I-V Characteristics.;

    Sammanfattning : Silicon carbide (SiC) is one of the attractive semiconductors due to its good electrical, thermal and mechanical properties. It is a promising material for high temperature, high power and high frequency application. Reliable electrodes are always necessary to utilise SiC for electronic devices. LÄS MER

  2. 2. Tailoring of Contacts on Silicon Carbide - Procedures and Mechanisms

    Författare :S. A. Perez-Garcia; [2007]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; interfacial reaction; metallic contacts; Silicon carbide; silicides; XPS.;

    Sammanfattning : Silicon carbide (SiC) exhibits very good electrical, thermal, chemical and mechanical properties which make it suitable for the next generation of wide band gap electronic devices, where silicon (Si) cannot be used due to its limitations with respect to the mentioned properties. Nickel (Ni) and Tantalum (Ta) are among the metals used for the contact formation. LÄS MER

  3. 3. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

    Författare :Sun Peng; [2005]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

    Sammanfattning : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. LÄS MER

  4. 4. The synthesis, surface modification and use of metal-oxide nanoparticles in polyethylene for ultra-low transmission-loss HVDC cable insulation materials

    Detta är en avhandling från Stockholm : KTH Royal Institute of Technology

    Författare :Amir Masoud Pourrahimi; KTH.; [2016]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; polyethylene; metal-oxide nanoparticles; heat treatment; surface coating; humidity resistance; interfacial adhesion; nanocomposite; HVDC insulation; polyeten; metalloxid nanopartiklar; värmebehandling; ytmodifiering av partiklarna; fukt inverkan; gränsskiktsvidhäftning; nanokomposit; HVDC isolering; Fiber- och polymervetenskap; Fibre and Polymer Science;

    Sammanfattning : Polyethylene composites which contain low concentrations of metal-oxide nanoparticles e.g. ZnO and MgO are emerging materials for the use in insulations of extruded high-voltage direct-current (HVDC) cables. LÄS MER

  5. 5. Interfacial Phenomena in Two-Phase systems: Emulsions and slag Foaming

    Detta är en avhandling från Stockholm : Materialvetenskap

    Författare :Abha Kapilashrami; KTH.; [2004]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; film formation; o w emulsion; substrate effect; slag forming; Materialvetenskap; TECHNOLOGY Materials science; TEKNIKVETENSKAP Teknisk materialvetenskap;

    Sammanfattning : In the present work studies were performed to provide understanding for further model development of the two-phase phenomena, film formation from o/w emulsions and slag foaming.The drying of o/w emulsions of different oil viscosities on hydrophobic and hydrophilic substrates was studied. LÄS MER