Sökning: "interconnect modeling"

Visar resultat 1 - 5 av 7 avhandlingar innehållade orden interconnect modeling.

1. 1. Modeling of stresses and deformation in thin film and interconnect line structures

   Författare :Adam Wikström; KTH; []
   Nyckelord :Thin films; thermal stress; theory and modeling; interconnect lines; finite element; texture; copper; unpassivated lines; passivated lines;

   Sammanfattning : .... LÄS MER

3. 2. Modeling, Control and Protection of Low-Voltage DC Microgrids

   Författare :Daniel Salomonsson; Lennart Söder; Brian K. Johnsson; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; circuit transient analysis; dc power systems; dispersed storage and generation; load modeling; power conversion; power distribution control; power distribution faults; power distribution protection; power electronics; Electric power engineering; Elkraftteknik;

   Sammanfattning : Current trends in electric power consumption indicate an increasing use of dc in end-user equipment, such as computers and other electronic appliances used in households and offices. With a dc power system, ac/dc conversion within these loads can be avoided, and losses reduced. LÄS MER

4. 3. Low Power Design Techniques for Deep Submicron Technology with Application to Wireless Transceiver Design

   Författare :Imed Ben Dhaou; KTH; []
   Nyckelord :Low-power design; deep-submicron technology; interconnect modeling; high-level power estimation; VLSI for DSP;

   Sammanfattning : .... LÄS MER

5. 4. Concurrent chip and package design for radio and mixed-signal systems

   Författare :Meigen Shen; Li-Rong Zheng; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik;

   Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER

7. 5. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER