Sökning: "interconnect lines"

Visar resultat 1 - 5 av 14 avhandlingar innehållade orden interconnect lines.

  1. 1. Modeling of stresses and deformation in thin film and interconnect line structures

    Författare :Adam Wikström; KTH; []
    Nyckelord :Thin films; thermal stress; theory and modeling; interconnect lines; finite element; texture; copper; unpassivated lines; passivated lines;

    Sammanfattning : .... LÄS MER

  2. 2. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Författare :Li-Han Hsu; Chalmers University of Technology; []
    Nyckelord :Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER

  3. 3. Efficient high-speed on-chip global interconnects

    Författare :Peter Caputa; Christer Svensson; Hartmut Grabinski; Linköpings universitet; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectronics; Global Interconnects; On-Chip Interconnects; Velocity-of-Light Delay; On-Chip Communication; Low-Latency; Transmission Lines; Electronics; Elektronik;

    Sammanfattning : The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. LÄS MER

  4. 4. Wafer-level heterogeneous integration of MEMS actuators

    Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Nyckelord :NATURAL SCIENCES; NATURVETENSKAP; NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  5. 5. Design of efficient high-speed on-chip global interconnects

    Författare :Peter Caputa; Li-Rong Zheng; Linköpings universitet; []

    Sammanfattning : The development of integrated circuits is continuously moving towards a System-on­ Chip realization where global interconnects, connecting circuit blocks separated by a long distance, have been considered a showstopper for process scaling due to their RC-delays. Our knowledge today is that high-speed interconnects must be described by models which include not only R and C, but also inductance and skin effect. LÄS MER