Sökning: "hybrid substrate"
Visar resultat 1 - 5 av 68 avhandlingar innehållade orden hybrid substrate.
1. Fabrication and Characterization of Si-on-SiC Hybrid Substrates
Sammanfattning : In this thesis, we are making a new approach to fabricate silicon on insulator (SOI). By replacing the buried silicon dioxide and the silicon handling wafer with silicon carbide through hydrophilic wafer bonding, we have achieved silicon on crystalline silicon carbide for the first time and silicon on polycrystalline silicon carbide substrates at 150 mm wafer size. LÄS MER
2. Hybrid printing on fibre-based packaging : Performance, Quality and Market
Sammanfattning : Variable data will play a decisive role in the future of packaging and product promotion. Variable data printing (VDP) is a technique whereby certain information can be altered in an otherwise static layout with the help of a digital printing system, and in the packaging industry a wide range of applications is possible. LÄS MER
3. Integrated Antennas : Monolithic and Hybrid Approaches
Sammanfattning : This thesis considers integration of antennas and active electronics manufactured on the same substrate. The main topic is on-chip antennas for commercial silicon processes, but hybrid integration using printed circuit board technology is also addressed. LÄS MER
4. Functional studies of a membrane-anchored cellulase from poplar
Sammanfattning : Cellulose in particular and wood in general are valuable biomaterials for humanity, and cellulose is now also in the spotlight as a starting material for the production of biofuel. Understanding the processes of wood formation and cellulose biosynthesis could therefore be rewarding, and genomics and proteomics approaches have been initiated to learn more about wood biology. LÄS MER
5. Design and Characterization of RF-LDMOS Transistors and Si-on-SiC Hybrid Substrates
Sammanfattning : With increasing amount of user data and applications in wireless communication technology, demands are growing on performance and fabrication costs. One way to decrease cost is to integrate the building blocks in an RF system where digital blocks and high power amplifiers then are combined on one chip. LÄS MER