Sökning: "high-frequency electronics"

Visar resultat 1 - 5 av 72 avhandlingar innehållade orden high-frequency electronics.

1. 1. Flip chip for high frequency applications : materials aspects

   Författare :Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

   Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER

3. 2. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

   Författare :Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER

4. 3. Alternative electronic packaging concepts for high frequency electronics

   Författare :Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

   Sammanfattning : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. LÄS MER

5. 4. Graphene field-effect transistors for high frequency applications

   Författare :Muhammad Asad; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; high frequency; Graphene; transit frequency; transconductance; maximum frequency of oscillation; contact resistance; microwave electronics; field-effect transistors;

   Sammanfattning : Rapid development of wireless and internet communications requires development of new generation high frequency electronics based on new device concepts and new materials. The very high intrinsic velocity of charge carriers in graphene makes it promising new channel material for high frequency electronics. LÄS MER

7. 5. High frequency electronic packaging and components : characterization, simulation, materials and processing

   Författare :Christian Johansson; Mats Robertsson; Li-Rong Zheng; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER®; permittivity; printed diode; sequential build-up; silicone elastomer; Signal processing; Signalbehandling;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. LÄS MER