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Visar resultat 6 - 10 av 349 avhandlingar som matchar ovanstående sökkriterier.
6. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER
7. Estimation of Forest Biomass and Faraday Rotation using Ultra High Frequency Synthetic Aperture Radar
Sammanfattning : Synthetic Aperture Radar (SAR) data in the Ultra High Frequency (UHF; 300 MHz – 3 GHz)) band have been shown to be strongly dependent of forest biomass, which is a poorly estimated variable in the global carbon cycle. In this thesis UHF-band SAR data from the fairly flat hemiboreal test site Remningstorp in southern Sweden were analysed. LÄS MER
8. End-Shield Bridges for High-Speed Railway : Full scale dynamic testing and numerical simulations
Sammanfattning : The increasing need for High-Speed Railway (HSR) to reduce the travelling time requires increasing research within this field. Bridges are main components of any railway network, including HSR networks, and the optimization of their design for this purpose would contribute to a faster and more cost effective development of the HSR network. LÄS MER
9. Frequency response by wind farms in power systems with high wind power penetration
Sammanfattning : The integration of variable speed wind turbines (VSWT) in power systems is increasing in order to reduce the emission of green house gases. This increase of power electronic converter interfaced generation causes a decrease of power system inertia, increasing the risk of load shedding and system frequency instability. LÄS MER
10. Improved PWB test methodologies
Sammanfattning : Printed Wiring Board (PWB) and Printed Circuit Board Assembly (PCBA) testing aims to ensure an error free board after the etching and the assembly processes. After the etching process, several types of errors might occur such as opens and bridges, which are already, showstoppers in Direct Current (DC) applications. LÄS MER