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Visar resultat 1 - 5 av 229 avhandlingar som matchar ovanstående sökkriterier.
1. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER
2. High frequency electronic packaging and components : characterization, simulation, materials and processing
Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. LÄS MER
3. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging
Sammanfattning : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. LÄS MER
4. High Frequency Characterization and Modeling of SiGe Heterojunction Bipolar Transistors
Sammanfattning : .... LÄS MER
5. Graphene field-effect transistors for high frequency applications
Sammanfattning : Rapid development of wireless and internet communications requires development of new generation high frequency electronics based on new device concepts and new materials. The very high intrinsic velocity of charge carriers in graphene makes it promising new channel material for high frequency electronics. LÄS MER