Sökning: "graphene network"
Visar resultat 1 - 5 av 15 avhandlingar innehållade orden graphene network.
1. Aqueous graphene dispersions for paper packaging
Sammanfattning : Graphene is widely touted as the thinnest and the most versatile material available. As an atomically thin layer of carbon atoms arranged in a hexagonal configuration, graphene has a combination of technologically important properties, such as thermal and electrical conductivity, mechanical strength, and impermeability to gases. LÄS MER
2. Biosensing platforms using graphene based bioreactive nanostructures with various dimensions
Sammanfattning : Nanomaterials have brought new aspects and improvements to the biosensing field due to their unique physical and chemical properties that are not shown in the bulk state. This thesis focuses on concepting, developing and testing of biosensors where nanomaterials including graphene gold nanoparticles (AuNPs) and magnetic nanoparticles (MNPs) constitute the biosensors. LÄS MER
3. Simple Models for Complex Nonequilibrium Problems in Nanoscale Friction and Network Dynamics
Sammanfattning : This doctoral thesis investigates three different topics: How friction evolves in atomically thin layered materials (2D materials); How social dynamics can be used to model grand scale common-pool resource games; Benchmarking of various image reconstruction algorithms in atomic force microscopy experiments. While these topics are diverse, they share being complex out-of-equilibrium systems. LÄS MER
4. Electrochemical Application and AFM Characterization of Nanocomposites : Focus on Interphase Properties
Sammanfattning : The use of graphene and conductive polyaniline nanomaterials in the field of electrochemistry is increasing due to their excellent conductivity, rapid electron transfer and high specific surface area. However, these properties are strongly dependent on the preparation processes. LÄS MER
5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER