Sökning: "good and good for"
Visar resultat 1 - 5 av 6560 avhandlingar innehållade orden good and good for.
Sammanfattning : Ultrasound-based imaging technique is probably the most used approach for rapid investigationand monitoring of anatomical and physiological conditions of internal organs and tissues.Ultrasound-based techniques do not require the use of ionizing radiation making the tests anexceptionally safe and painless. LÄS MER
- Detta är en avhandling från Stockholm : Almqvist & Wiksell International / Acta Universitatis Stockholmiensis
Sammanfattning : The purpose of this work is to detect a pattern: the concordance of Ethics and Aesthetics, Poetics and Politics in the most influential American thinker of the nineteenth century. It is an attempt to trace a basic concept of the Emersonian transcendentalist doctrine, its development, its philosophical meaning and practical implications. LÄS MER
- Detta är en avhandling från Linköping : Linköping University Electronic Press
Sammanfattning : Health care systems in many countries are experiencing a growing demand while their resources remain limited. The discrepancy between demand and capacity creates many problems – long waiting times for treatment, overcrowding in hospital wards, high workload, etc. LÄS MER
4. Anaerobic digestion in the kraft pulp and paper industry Challenges and possibilities for implementationDetta är en avhandling från Linköping : Linköping University Electronic Press
Sammanfattning : The pulp and paper industry is a large producer of wastewater and sludge, putting high pressure on waste treatment. In addition, more rigorous environmental legislation for pollution control and demands to increase the use of renewable energy have put further pressure on the pulp and paper industry’s waste treatment, where anaerobic digestion (AD) and the production of methane could pose a solution. LÄS MER
- Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis
Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER