Sökning: "fibers electrospun"
Visar resultat 1 - 5 av 12 avhandlingar innehållade orden fibers electrospun.
1. Functional Fibers for Biomedical and Thermal Management Applications
Sammanfattning : This thesis explores the integration of electrospun polymeric structures in two fields; fibrous scaffolds as cell culture substrates for biomedical applications and fiber carrier networks in metal matrix polymer composites as thermal interface materials in microsystems. Electrospinning has been found to carry great potential for a range of future biomedical engineering applications. LÄS MER
2. Structural properties and micromechanics of PMMA-based electrospun hybrid fibers
Sammanfattning : .... LÄS MER
3. Chemical Modification of Electrospun Cellulose Nanofibers
Sammanfattning : The forest industry is a large part of the Swedish economy and the export of pulp, paper and wood products constitutes 11% of the total Swedish export of goods. The main product of a pulp mill is purified cellulose, which has many great properties like biodegradability and non-toxicity. LÄS MER
4. Wood-derived lignin-based fibers as supercapacitor electrodes
Sammanfattning : Today, in order to replace fossil energy sources with renewable energy sources such as solar and wind, reliable energy storage systems that can provide power regardless of the intermittent nature of the energy sources must be created. Especially with the future’s rising energy demands the development of such energy storage systems from green-collar materials with the least negative environmental impact is pressing. LÄS MER
5. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging
Sammanfattning : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER