Sökning: "energy materials"
Visar resultat 21 - 25 av 2288 avhandlingar innehållade orden energy materials.
21. Phase Equilibrium-aided Design of Phase Change Materials from Blends : For Thermal Energy Storage
Sammanfattning : Climate change is no longer imminent but eminent. To combat climate change, effective, efficient and smart energy use is imperative. Thermal energy storage (TES) with phase change materials (PCMs) is one attractive choice to realize this. LÄS MER
22. High Temperature Corrosion of FeCrAl Alloys in Biomass- and Waste-fired Boilers - The Influence of Alloying Elements in Prediction and Mitigation of Corrosion in Harsh Environments
Sammanfattning : Combustion of biomass and waste for heat and power production is an alternative to fossil fuels and can be an important step towards a more sustainable future. The electrical efficiency of the fuel-to-energy conversion process is largely dependent on the steam parameters (temperature and pressure) of the combined heat and power (CHP) plants. LÄS MER
23. Conducting Polymer Electrodes for Thermogalvanic Cells
Sammanfattning : Fossil fuels are still the dominant (ca. 80%) energy source in our society. A significant fraction is used to generate electricity with a heat engine possessing an efficiency of approximately 35%. Therefore, about 65% of fossil fuel energy is wasted in heat. LÄS MER
24. Design of Thermal Energy Storage with Phase Change Materials - Investigations within Material, Device and System Scale
Sammanfattning : The addition of a thermal energy storage (TES) into a process allows the operator to store and release thermal energy on demand. This increased process flexibility leads to potential benefits such as shifting energy demand from peak to off-peak hours. LÄS MER
25. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER