Sökning: "electronics and electrical engineering"
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706 avhandlingar innehållade orden electronics and electrical engineering.
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Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis
Författare :Seung Hee Jeong; Uppsala universitet.; Uppsala universitet.; [2016]
Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Liquid; Elastomer; Cross-linking; Liquid alloy; PDMS; Adaptability; Compliance; Interface; Patterning; Printing; Surface energy; Wetting; Composite; Modulus; Stretchability; Viscoelasticity; Thermal conductivity; Contact resistance; Adhesion; Packaging; Integration; Microsystems; Microfluidics; Strain sensor; Thermoelectrics; Inductive coupling; Wireless communication; Stretchable electron-ics; Epidermal electronics; Skin electronics; Soft robotics; Wearable electronics; Teknisk fysik med inriktning mot mikrosystemteknik; Engineering Science with specialization in Microsystems Technology; Teknisk fysik med inriktning mot materialvetenskap; Engineering Science with specialization in Materials Science;
Sammanfattning :
Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. LÄS MER
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Detta är en avhandling från Stockholm : KTH
Författare :Erik Fredenberg; KTH.; [2009]
Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; mammography; x-ray optics; photon counting; spectral shaping; spectral imaging; collimation; radiation dose; signal-to-noise ratio; quantum noise; anatomical noise; spatial resolution; x-ray flux; ; TECHNOLOGY; TEKNIKVETENSKAP; TECHNOLOGY Engineering physics; TEKNIKVETENSKAP Teknisk fysik; TECHNOLOGY Engineering physics Optical physics; TEKNIKVETENSKAP Teknisk fysik Optisk fysik; TECHNOLOGY Engineering physics Other engineering physics; TEKNIKVETENSKAP Teknisk fysik Övrig teknisk fysik; TECHNOLOGY Electrical engineering; electronics and photonics; TEKNIKVETENSKAP Elektroteknik; elektronik och fotonik; TECHNOLOGY Other technology Medical engineering; TEKNIKVETENSKAP Övriga teknikvetenskaper Medicinsk teknik; MEDICINE Physiology and pharmacology Radiological research; MEDICIN Fysiologi och farmakologi Radiologisk forskning;
Sammanfattning :
Early detection is vital to successfully treating breast cancer, and mammography screening is the most efficient and wide-spread method to reach this goal. Imaging low-contrast targets, while minimizing the radiation exposure to a large population is, however, a major challenge. LÄS MER
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Detta är en avhandling från Stockholm : KTH
Författare :Xin Luo; [2014]
Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;
Sammanfattning :
This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER
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Detta är en avhandling från ; Chalmers tekniska högskola; Gothenburg
Författare :Shuangxi Sun; [2017]
Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;
Sammanfattning :
3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER
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Detta är en avhandling från Department of Industrial Electrical Engineering and Automation, Lund Institute of Technology
Författare :Bengt Johansson; Lunds universitet.; Lund University.; [2005]
Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; robotics; buck; dc-dc converter; modeling; audio susceptibility; current-mode control; load current; gain scheduling; current transformer; experimental verification; Electronics and Electrical technology; Automation; Elektronik och elektroteknik; Elektroteknik; Electrical engineering; reglerteknik; robotteknik; Automatiska system; control engineering;
Sammanfattning :
To obtain high performance control of a dc-dc converter, a good model of the converter is needed. The load usually affects the dynamics and one way to take this into consideration is to regard the load as a part of the converter. The load is often the most variable part of this system. LÄS MER
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