Sökning: "double cantilever beam"
Visar resultat 1 - 5 av 13 avhandlingar innehållade orden double cantilever beam.
1. Wafer Bonding for Spaceflight Applications : Processing and Characterisation
Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER
2. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding
Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER
3. Impact response and delamination of composite plates
Sammanfattning : This thesis covers a selection of issues associated with impact response and delarknation of composite plates. The problems include contact problems, impact response and delankration testing. LÄS MER
4. Application of cohesive modeling in joining technology : Thick adhesive layers and rivet joints
Sammanfattning : This thesis summarizes the development of cohesive modeling of joints. It presents some new developments regarding the effects of non-zero thickness of adhesive layers and a novel approach of using the concept of cohesive modeling to characterize the failure behavior of rivet joints. LÄS MER
5. Application of cohesive modeling in joining technology
Sammanfattning : ABSTRACTThis thesis summarizes the development of cohesive modeling of joints. It presents some new developments regarding the effects of non-zero thickness of adhesive layers and a novel approach of using the concept of cohesive modeling to characterize the failure behavior of rivet joints. LÄS MER