Sökning: "direct bonding"

Visar resultat 1 - 5 av 52 avhandlingar innehållade orden direct bonding.

  1. 1. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  3. 2. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

    Författare :Anke Sanz-Velasco; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

    Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER

  4. 3. Silicon and Quartz Microengineering : Processing and Characterisation

    Författare :Örjan Vallin; Peter Enoksson; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; silicon; quartz; microengineering; microstructure; MEMS; wafer bonding; direct bonding; adhesion quantification; Teknisk fysik; Engineering physics; Teknisk fysik;

    Sammanfattning : Microengineering has developed a broad range of production techniques to reduce size, increase throughput, and reduce cost of electrical and mechanical devices. The miniaturisation has also entailed entirely new opportunities. LÄS MER

  5. 4. Plasma assisted low temperature semiconductor wafer bonding

    Författare :Donato Pasquariello; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER

  7. 5. Probing molecular adsorbates with core level spectroscopies : Electronic structure and bonding models

    Författare :Alexander Föhlisch; Uppsala universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Physics; Fysik; Physics; Fysik; fysik; Physics;

    Sammanfattning : Resonantly excited X-ray emission spectroscopy has been applied to study the valence electronic structure of molecular adsorbates in an atom specific and orbital symmetry selective manner. In combination with ab initio cluster calculations, electronic structure and bonding models have been derived. LÄS MER