Sökning: "chip-package co-design"
Hittade 2 avhandlingar innehållade orden chip-package co-design.
1. System-on-package solutions for multi-band RF front end
Sammanfattning : Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. LÄS MER
2. VCOs for future generations of wireless radio transceivers
Sammanfattning : .... LÄS MER
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