Sökning: "carbon nanofiber"
Visar resultat 1 - 5 av 11 avhandlingar innehållade orden carbon nanofiber.
1. Toward Carbon based NEMS
Sammanfattning : A systematic analysis and assessment of carbon nanotube (CNT) based NEMS switches is presented and their features are compared to typical complementary metal-oxide-semiconductor (CMOS) performance parameters. It is shown that CNT-based switches with considerably smaller leakage current compared to CMOS switches can be realized. LÄS MER
2. Tunable photonic crystals based on carbon nanofibers
Sammanfattning : Photonic crystals are materials with periodically varying refractive indices. In conventional photonic crystal design it is hard to achieve tunable structures in the visible range, i.e. structures with changeable optical properties. LÄS MER
3. Towards the Integration of Carbon nanostructures into CMOS technology
Sammanfattning : Relentless efforts for miniaturization of traditional complementary metal oxide semiconductor (CMOS) devices have reached the limit where the device characteristics are governed by quantum phenomena which are difficult to control. This engendered a need for finding alternative new materials that can be engineered to fabricate devices that will possess at least the same or even better performance than existing CMOS devices. LÄS MER
4. Electrochemical capacitors for miniaturized self-powered systems: challenges and solutions
Sammanfattning : Electrochemical capacitors (ECs), also known as supercapacitors, are recognized as a key technology that will enable miniaturized self-powered systems, which will constitute the hardware base nodes of the internet of things (IoT), the internet of everything (IoE) and the tactile internet. Systems employing ECs can be designed to be maintenance-free thanks to the ultra-long cycling stability of ECs. LÄS MER
5. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging
Sammanfattning : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. LÄS MER