Sökning: "bonding energy"
Visar resultat 6 - 10 av 147 avhandlingar innehållade orden bonding energy.
6. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding
Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER
7. Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors
Sammanfattning : The constant miniaturization and steady performance improvement of electronics devices have generated innovative ideas such as internet of thing (IoT), which also includes devices with integrated energy sources. The high performance is conceived by the high density of the devices on a chip leading to a high density of interconnects, to connect these devices to outside world. LÄS MER
8. Ash chemistry and fuel design focusing on combustion of phosphorus-rich biomass
Sammanfattning : Biomass is increasingly used as a feedstock in global energy production. This may present operational challenges in energy conversion processes which are related to the inorganic content of these biomasses. As a larger variety of biomass is used the need for a basic understanding of ash transformation reactions becomes increasingly important. LÄS MER
9. Distributions Of Fiber Characteristics As A Tool To Evaluate Mechanical Pulps
Sammanfattning : Mechanical pulps are used in paper products such as magazine or news grade printing papers or paperboard. Mechanical pulping gives a high yield; nearly everything in the tree except the bark is used in the paper. This means that mechanical pulping consumes much less wood than chemical pulping, especially to produce a unit area of printing surface. LÄS MER
10. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER
