Sökning: "bonding ability"

Visar resultat 1 - 5 av 39 avhandlingar innehållade orden bonding ability.

  1. 1. Bonding Ability Distribution of Fibers in Mechanical Pulp Furnishes

    Detta är en avhandling från Sundsvall : FSCN - Fibre Science and Communication Network

    Författare :Sofia Reyier; Mittuniversitetet.; [2008]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fiber; mechanical pulp; bonding ability; fiber characterization; Bonding Indicator; BIN; acoustic emission; hydrocyclone; Fiberlab; collapse resistance; fibrillation; Fiber; mekanisk massa; bindningsförmåga; fiber karakterisering; Bindnings Indikator; BIN; akustisk emission; hydrocyklon; Fiberlab; kollaps resistans; fibrillering; TECHNOLOGY Chemical engineering Chemical process and manufacturing engineering Cellulose and paper engineering; TEKNIKVETENSKAP Kemiteknik Kemisk process- och produktionsteknik Cellulosa- och pappersteknik;

    Sammanfattning : This thesis presents a method of measuring the distribution of fiber bonding ability in mechanical pulp furnishes. The method is intended for industrial use, where today only average values are used to describe fiber bonding ability, despite the differences in morphology of the fibers entering the mill. LÄS MER

  2. 2. Distributions Of Fiber Characteristics As A Tool To Evaluate Mechanical Pulps

    Detta är en avhandling från Sundsvall : Mid Sweden University

    Författare :Sofia Reyier Österling; Mittuniversitetet.; [2015]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fiber; fibre; fiber characteristics; fiber dimension; fiber properties; mechanical pulp; FiberLab; raw data; distribution; fiber wall thickness; BIN; bonding ability influence; bonding indicator; bonding ability; fiber width; fibrillation; collapse resistance; laboratory sheet; fiber analyzer; optical analyzer; TMP; CTMP; SGW; sheet model; prediction; fiber characterization; hydrocyclone; fractionation; kernel density estimation; KDE; diffusion mixing; acoustic emission; F0.90; Norway spruce; Picea abies;

    Sammanfattning : Mechanical pulps are used in paper products such as magazine or news grade printing papers or paperboard. Mechanical pulping gives a high yield; nearly everything in the tree except the bark is used in the paper. This means that mechanical pulping consumes much less wood than chemical pulping, especially to produce a unit area of printing surface. LÄS MER

  3. 3. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Detta är en avhandling från Stockholm : Signaler, sensorer och system

    Författare :Niklaus Frank; KTH.; [2002]
    Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

  4. 4. Teaching and learning of chemical bonding models Aspects of textbooks, students’ understanding and teachers’ professional knowledge

    Detta är en avhandling från Karlstads universitet

    Författare :Anna Bergqvist; Karlstads universitet.; [2017]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Chemical bonding models; Pedagogical content knowledge; Teachers professional development; Chemistry education; Students learning; Kemi; Chemistry;

    Sammanfattning : Despite the growing importance of science and technology in society, school students consider these subjects irrelevant and hard to learn. Teachers must therefore know how to teach science in ways that enhance students’ understanding and interest. LÄS MER

  5. 5. Integration and Packaging Concepts for Infrared Bolometer Arrays 

    Detta är en avhandling från Stockholm : KTH

    Författare :Adit Decharat; KTH.; [2009]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; TECHNOLOGY Electrical engineering; electronics and photonics Other electrical engineering; electronics and photonics; TEKNIKVETENSKAP Elektroteknik; elektronik och fotonik Övrig elektroteknik; elektronik och fotonik;

    Sammanfattning :  Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. LÄS MER